发明名称 PHOTOSENSITIVE RESIN COMPOSITION, ARTICLE MADE BY USING THE SAME AND METHOD OF FORMING NEGATIVE-TYPE PATTERN
摘要 <P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition which has high sensitivity, can provide a large dissolution contrast irrespective of the kind of a polyimide precursor and, resultantly, can provide a pattern having a preferable shape while maintaining sufficient process margin. <P>SOLUTION: The photosensitive resin composition contains a photobase generating agent and a polyimide precursor as specified compounds which are constituted of an anthracene skeleton or a thioxantone skeleton and have a substituted group of CH<SB>2</SB>2-Y<SP>+</SP>X<SP>-</SP>as a base-producing part (here, Y<SP>+</SP>denotes specified quaternary ammonio group and X<SP>-</SP>denotes its counter ion). <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2009244745(A) 申请公布日期 2009.10.22
申请号 JP20080093342 申请日期 2008.03.31
申请人 DAINIPPON PRINTING CO LTD 发明人 FUKUDA TOSHIHARU;SAKAYORI KATSUYA;KATAYAMA ASAMI
分类号 G03F7/038;G03F7/004;G03F7/40;H01L21/027 主分类号 G03F7/038
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