| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a mounting device for a chip component, allowing short operating time for mounting a chip component after cutting, and reliably mounting only an undamaged, non-defective chip component. <P>SOLUTION: The mounting device includes a carrier 24, which transports a chip component 6a, peeled from a holding sheet for holding cut individual chip components 6a, to a mounting substrate 20, and mounts the chip component 6a thereon. The carrier 24 is provided with measuring terminals 18 and 26 for measuring electric properties of the chip component 6a during transporting. A control circuit is provided for the mounting device for controlling the carrier 24 so as to mount the chip component 6a on the mounting substrate 20 only when a measurement of the chip component 6a determined through measuring terminals 18 and 26 satisfies mountable conditions. <P>COPYRIGHT: (C)2010,JPO&INPIT |
