| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive tape for the surface protection for a semiconductor wafer, which is excellently peeled even in thickness, diameter and surface film state (polyimide, benzocyclobutene etc.) of wafer conventionally having difficulty in peeling in a process in which an adhesive tape for the surface protection for a semiconductor wafer is pasted to a semiconductor wafer, the back of the semiconductor wafer is ground and the tape is peeled. SOLUTION: The adhesive tape for the surface protection for a semiconductor wafer has an adhesive layer on a substrate film in which the contact angle of methylene iodide on the surface of the adhesive layer at 23°C is≥40 degrees and≤70 degrees and the adhesive force of the adhesive tape to SUS280 polished surface is≤1 N/25 mm. COPYRIGHT: (C)2010,JPO&INPIT |
