| 摘要 |
PROBLEM TO BE SOLVED: To provide a for electric or electronic equipment which has high electric conductivity of≥50% IACS hardly achieved in a Cu-Ni-Si series and is excellent in strength, stress-relaxation resistance and bendability, and to provide a producing method by which the crystal grain diameter of the copper alloy material can be controlled. SOLUTION: The copper alloy material contains, composed by mass%, 0.1-4% X elements (wherein, the X elements are one or two or more elements in transition elements of Ni, Fe, Co and Cr) and 0.01-3% Y elements (wherein, the Y elements are one or two or more elements of Ti, Si, Zr and Hf) and the balance copper with inevitable impurities. The alloy material has≥50% IACS electric conductivity and≥600 MPa proof strength and the stress-relaxation ratio at the time of holding 1,000 hours under state of giving the stress having 80% proof strength, is≤20%. COPYRIGHT: (C)2010,JPO&INPIT
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