| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a copper alloy foil reduced in bending repulsive force (spring back). Ž<P>SOLUTION: The copper alloy foil has a thickness t of ≤20 μm and satisfies Ra/t≤0.009 (wherein Ra represents an arithmetic average roughness), and I/I<SB>0</SB>of a (200) face after heat treatment at 300°C for 30 min is ≥65. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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