CARRIER-ATTACHED ALLOY FOIL FOR LAMINATION ON CIRCUIT SUBSTRATE, CARRIER-ATTACHED COMPOSITE FOIL FOR LAMINATION ON CIRCUIT SUBSTRATE, METAL COATING BOARD, PRINTED WIRING BOARD, AND PRINTED WIRING LAMINATED BOARD

摘要

<P>PROBLEM TO BE SOLVED: To use carrier-attached extremely thin copper/alloy composite foil or extremely thin alloy foil enabling an arbitrary change of a linear expansion coefficient to reduce a problem of a warp on a metal coating board, a printed wiring board, or a laminated board and a problem of a solder crack or the like on a connection spot on a package carrying copper foil. Ž<P>SOLUTION: A circuit substrate is laminated with carrier-attached Fe-Ni alloy foil or composite foil composed of carrier-attached copper foil and Fe-Ni alloy foil. The linear expansion coefficient of the Fe-Ni alloy foil is matched to the linear expansion coefficient of the circuit substrate by changing a compounding ratio between an Fe component and an Ni component. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž