ADHESIVE COMPOSITION, ADHESIVE FOR CIRCUIT CONNECTION, CONNECTED STRUCTURE, AND SEMICONDUCTOR DEVICE

摘要

Disclosed is an adhesive composition containing (a) a thermoplastic resin, (b) a radically polymerizable compound containing two or more (meth)acryloyl groups and two or more urethane bonds in a molecule and having a weight average molecular weight of not less than 10,000 and (c) a radical polymerization initiator. The adhesive composition exhibits sufficient adhesion even when the composition is cured at a low temperature in a short time, and has excellent storage stability. A connected structure using the adhesive composition has high connection reliability even after long-time exposure to high temperature and high humidity environments. An adhesive for circuit connection using the adhesive composition, a connected structure and a semiconductor device are also disclosed.