发明名称 PRINTED WIRING BOARD, AND METHOD FOR MANUFACTURING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a printed wiring board solving the problem of degradation of connection reliability in electrical connection by eliminating production of base material powder due to contact between a printed contact and a socket terminal; and to provide a manufacturing method of the printed wiring board. Ž<P>SOLUTION: This printed wiring board has printed contacts for socket insertion formed into a pattern. In the printed wiring board, the printed contacts are formed by covering at least a part of an end surface. In this manufacturing method of the printed wiring board on which the printed contacts are formed by covering at least a part of the end surface, the end surface is formed by boring an oval hole on a copper clad laminate mold body; then the mold body is copper-plated; thereafter the end surface is closed by a resist agent to form sagging; the pattern of the printed contacts is formed; a part of the sagging of the end surface is hardened; and thereafter etching and separation are executed. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2009246135(A) 申请公布日期 2009.10.22
申请号 JP20080090806 申请日期 2008.03.31
申请人 HITACHI CHEM CO LTD 发明人 KITAGUCHI KATSUYA;TAZAWA KAZUYUKI;TAMURA YOSHIHIRO;KOSHIKAWA YASUYUKI;YOSHIDA YASUYUKI
分类号 H05K1/11;H05K3/40 主分类号 H05K1/11
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