发明名称 |
PERFORATED SUBSTRATES FOR FORMING HOUSINGS |
摘要 |
A housing for an electronic device as well as methods for forming the housing are disclosed. The housing can be formed from a substrate having perforations to assist in adhering components internal to the housing. The substrate is typically a multi-layer substrate having at least two layers. In one embodiment, an inner layer of the multi-layer substrate can be provided with perforations. The perforations can them be used to adhere internal features to the multi-layer substrate. The internal features can be used for attaching parts or components to the multi-layer substrate, thereby securing the parts or components to the multi-layer substrate and thus the housing. |
申请公布号 |
WO2009129123(A1) |
申请公布日期 |
2009.10.22 |
申请号 |
WO2009US40103 |
申请日期 |
2009.04.09 |
申请人 |
APPLE INC.;WEBER, DOUGLAS |
发明人 |
WEBER, DOUGLAS |
分类号 |
H05K5/02;B32B3/24;B32B38/04 |
主分类号 |
H05K5/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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