| 摘要 |
PURPOSE: A method for forming a thin film LTCC multilayer substrate is provided to miniaturize a module using LTCC technology by forming a thin resistor with high thermal stability on an insulation film of an LTCC multilayer wiring substrate. CONSTITUTION: An LTCC substrate is prepared(S10). An LTCC substrate is thermally processed(S20). An insulating layer is formed on the LTCC substrate(S60). The insulation layer is formed by ion assistant PVD(Physical Vapor Deposition), an electron beam deposition, a PLD(Pulsed Laser Deposition) or aerosol deposition. The insulation layer is made of high-k material. The thin film resistor layer is formed on the insulation layer(S80). The thin film conductive line is formed on the insulation layer and the thin film resistor layer(S120). The thin film resistor layer is thermally processed(S160).
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