METHOD OF WIRING TO ELECTRONIC ELEMENT BUILT-IN SUBSTRATE, AND METHOD OF MANUFACTURING ELECTRONIC ELEMENT BUILT-IN SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a method of precisely wiring an electronic element built in an electronic element built-in substrate and a land formed in an external layer of the electronic element built-in substrate.

SOLUTION: The method of wiring to the electronic element built-in substrate includes the steps of: mounting the electronic element 12 having terminal electrodes 14a and 14b on the substrate 10; recognizing the positions of the terminal electrodes; stacking the external layer on the substrate on which the electronic element is mounted; forming lands 24a to 24f on a surface of the external layer; collating the positions of the terminal electrodes with the positions of the lands to calculate laser irradiation paths; irradiating the substrate on which the external layer is laminated with laser light along the laser irradiation paths to form wiring holes connecting the positions of the lands and the positions of the terminal electrodes; and filling the wiring holes with conductors 32 to form wiring electrically connecting the lands and the terminal electrodes to each other.

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