发明名称 ELECTRONIC COMPONENT MOUNTING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide an electronic component mounting device accurately sucking or mounting an electronic component. <P>SOLUTION: In the electronic component mounting device, when a suction nozzle 15 starts descending, a CPU 101 starts suction control shown in Fig.13 and operates to acquire the position of a nozzle lift motor 51 from information of an encoder 98, to monitor whether the position has reached a previously obtained target position, that is, the position of a lower end of the suction nozzle 15 has reached a target height and to output a switch signal to a bulb 80 when the position of the nozzle lift motor 51 monitored by the CPU 101 has reached the target position and the suction nozzle 15 has reached the target height. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2009246303(A) 申请公布日期 2009.10.22
申请号 JP20080094180 申请日期 2008.03.31
申请人 HITACHI HIGH-TECH INSTRUMENTS CO LTD 发明人 HASHIZUME SHO;OKAMOTO MANABU;KANO YOSHINORI
分类号 H05K13/04 主分类号 H05K13/04
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