发明名称 MOUNTING METHOD OF ELECTRONIC COMPONENT
摘要 <P>PROBLEM TO BE SOLVED: To mount an electronic component surely onto a corresponding printed board regardless of provision of a plurality of positioning locations on carriers of one line or provision of two lines of carriers having the plurality of positioning locations. <P>SOLUTION: According to data on suction-taking-out/mounting of the electronic component, after positioning the printed boards P on two positioning parts 2B of both carriers 2, a mounting head 6 of a beam 4A mounts the electronic component onto the left board P positioned on the left positioning part 2B of the rear carrier 2 and then a mounting head 6 of a beam 4B mounts the electronic component onto the right board P positioned on the right positioning part 2B of the front carrier 2. Then, the mounting head 6 of the beam 4A mounts the electronic component onto the right board P positioned on the right positioning part 2B of the rear carrier 2 and the mounting head 6 of the beam 4B mounts the electronic component onto the left board P positioned on the left positioning part 2B of the front carrier 2. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2009246261(A) 申请公布日期 2009.10.22
申请号 JP20080093523 申请日期 2008.03.31
申请人 HITACHI HIGH-TECH INSTRUMENTS CO LTD 发明人 IZUMIHARA KOICHI;KAIZUMI KAZUYOSHI;ONISHI SEIJI;TSUJIMOTO YOSHIYUKI;SEKIGUCHI HIROTO
分类号 H05K13/04 主分类号 H05K13/04
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