| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a multilayer wiring circuit board such that manufacturing conditions in the multilayer wiring circuit board using a liquid crystal polymer are relieved and transmission loss in a high-frequency range as the feature of the liquid crystal polymer is reduced. <P>SOLUTION: The multilayer wiring circuit board is constituted by stacking a plurality of wiring boards each using the liquid crystal polymer for a base layer and provided with a circuit conductor layer on one surface or both surfaces thereof, and interposing an insulating layer formed of a resin containing siloxane denatured polyimide between the wiring boards. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
