| 摘要 |
PROBLEM TO BE SOLVED: To provide a high quality circuit board, achieving a stable thickness of a product and stable connection resistance by absorbing cushion material deformation during hot-pressing and by stabilizing pressure applied to the product. SOLUTION: A method includes steps of: preparing a laminated body which sandwiches a product part consisting of at least one product between first metal plates; forming a laminated construction in which second metal plates and cushion materials having a hole on at least one part thereof are arranged outside of the first metal plates; and heating and pressurizing the laminated construction. COPYRIGHT: (C)2010,JPO&INPIT |
