| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a control device which improves a heat radiation property of a sub-module by enlarging a heat radiation area of electronic parts mounted in the sub-module. Ž<P>SOLUTION: In the control device comprising a housing base, a control board, a sub-module, and a housing cover, an accommodation portion having a shape corresponding to a shape of each of electronic parts is arranged inside the housing cover. The sub-module is mounted to the housing cover with a heat radiation adhesive interposed between the accommodation portion and each of the electronic parts. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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