发明名称 METHOD FOR MANUFACTURING COMPLIANT SUBSTRATE, COMPLIANT SUBSTRATE MANUFACTURED THEREBY, GALLIUM NITRIDE BASED COMPOUND SEMICONDUCTOR DEVICE HAVING THE COMPLIANT SUBSTRATE AND MANUFACTURING METHOD THEREOF
摘要 A compliant substrate having a reduced stress, a method for manufacturing the same having a reduced manufacturing time, a gallium nitride based compound semiconductor device including the compliant substrate and a method for manufacturing the same are disclosed. The compliant substrate is manufactured by heating a substrate and a group III metal including at least one of an aluminum, a gallium and an indium, and a chloride based compound generated by introducing a HCl gas to the melted group III metal reacts with a NH3 gas to form a nitride based thin film on the wafer.
申请公布号 US2009261345(A1) 申请公布日期 2009.10.22
申请号 US20060989008 申请日期 2006.07.21
申请人 JIN YONG SUNG;LEE JAE HAK 发明人 JIN YONG SUNG;LEE JAE HAK
分类号 H01L29/24;C23C14/34;C30B19/00;H01L21/20;H01L33/00 主分类号 H01L29/24
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