PHOTOSENSITIVE ADHESIVE COMPOSITION, ADHESIVE SHEET, ADHESIVE PATTERN, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, AND SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a photosensitive adhesive composition which is excellent in pattern formation, adhesiveness after pattern formation, heat resistance after adhesion and moisture resistance reliability, to provide an adhesive sheet, an adhesive pattern, a semiconductor wafer with adhesive layer, and a semiconductor device which use the photosensitive adhesive composition and to provide a manufacturing method of the semiconductor device. SOLUTION: The photosensitive adhesive composition for semiconductor element comprises: an alkali-soluble polymer (A) as a copolymer including maleimide monomer having a maleimide group and monofunctional vinyl monomer as a monomer unit; a thermosetting resin (B); a radiation polymerizable compound (C); and a photo initiator (D). COPYRIGHT: (C)2010,JPO&INPIT