UNIFICATED OPTICAL MODULE PACKAGE AND FABRICATION METHOD THEREOF

摘要

PURPOSE: An integrated optical module package and a manufacturing method thereof are provided to improve integration of optical pars using a mirror surface of an emission optical system or incidence optical system as an incline between mount parts of a laser diode and a photodiode. CONSTITUTION: A base(101) includes a first mount part, a second mount part and an incline part. The first mount part provides a support surface for mounting a light emitting device. A second mount part provides the support surface for mounting a light receiving device. The incline part provides the mirror surface. The incline part is inclined to one or all of the first mount part and the second mount part. The light emitting device is attached to the first mount part. The light receiving device is attached to the second mount part. An optical axis of the light emitting device or light receiving device is arranged with the mirror surface of the incline part.