| 摘要 |
<p>A multilayer printed circuit board comprising a substrate (1) bearing conductor circuits (4) on both sides and having a plated-through hole (9) which connects the conductor circuits (4) and, as serially layered thereon, a resin insulating layer (2) and a conductor circuit (4,5) in an alternate fashion and in repetition, wherein the conductor circuits (4, 5) neighboring in up and down direction are connected through a via-hole (7),
characterized in that said plated-through hole (9) has a land (9a), that the via-hole (7) on the land (9a) is filled with a metal, that the upper face of said via-hole (7) and the upper face of said conductor circuit (5) in the same layer are kept in the substantially same plane, and that the distance from the bottom face to the upper face of said via-hole (7) is about 2 to 7 times as long as the thickness of said conductor circuit (5).</p> |
