| 摘要 |
A treating apparatus for spreading treatment gas uniformly all over a to-be-treated substrate mounted on a substrate mount while controlling the heat transfer rate between the substrate and the substrate mount to thereby uniformize the temperature of the to-be-treated substrate over the whole surface thereof. A porous substrate having a large number of communicating pores serves as the mount for treating the to-be-treated substrate mounted on the substrate mount disposed in a vacuum vessel while controlling the temperature of the to-be-treated substrate into a predetermined temperature. In the porous substrate, a large number of communicating pores are formed in a substrate to communicate with one another in all directions. The treatment gas diffuses uniformly from below through the communicating pores and spouts upward. An electrostatically chucking electrode is buried in a gas-permeable insulating film. The porous substrate is peripherally coated with a heat resistant insulating film of ceramics etc. |
