BACKLIGHT UNIT USING A THERMOPLASTIC RESIN BOARD

摘要

PURPOSE: A backlight unit using a thermoplastic resin substrate including a light emitting diode is provided to reduce the thickness of the backlight unit through a simple manufacturing process. CONSTITUTION: A backlight unit using a thermoplastic resin substrate including a light emitting diode includes a thermoplastic resin substrate(210), a liquid emitting diode(220), and a molding resin. The thermoplastic resin substrate is formed on the cavity. The light emitting diode is mounted on bottom of the cavity. The molding resin fixes liquid crystal display in the cavity. The optical reflection filler is included on the thermoplastic resin substrate.