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发明名称
CMP abrasive, liquid additive for CMP abrasive and method for polishing substrate.
摘要
申请公布号
EP1566421(A3)
申请公布日期
2009.10.21
申请号
EP20050075862
申请日期
1999.12.22
申请人
HITACHI CHEMICAL COMPANY, LTD.
发明人
AKAHORI, TOSHIHIKO;ASHIZAWA, TORANOSUKE;IRAI, KEIZO;KURIHARA, MIHO;YOSHIDA, MASATO;KURATA, YASUSHI
分类号
H01L21/304;B24B37/00;B24B37/04;B24D3/34;B44C1/22;C09G1/02;C09K3/14;C09K13/00;H01L21/302;H01L21/3105
主分类号
H01L21/304
代理机构
代理人
主权项
地址
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