发明名称 Method for applying an adhesive compound to a substrate
摘要 <p>Applying an adhesion promoting composition, containing adhesion promoting substance, to a substrate, comprises evaporating the adhesion promoting substance and transporting the formed vapor to the substrate using a carrier gas. An independent claim is included for a device for the execution of above process, comprising a block (4) with a carrier gas canal (14) and a device (26) for contacting the adhesion promoting substance into the carrier gas canal.</p>
申请公布号 EP2110420(A1) 申请公布日期 2009.10.21
申请号 EP20080154412 申请日期 2008.04.11
申请人 SIKA TECHNOLOGY AG 发明人 HUCK, WOLF-RUEDIGER;NUFER, REMO
分类号 C09J5/06 主分类号 C09J5/06
代理机构 代理人
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