SUB-MOUNT, LIGHT EMITTING DIODE PACKAGE AND MANUFACTURING METHOD THEREOF

摘要

PURPOSE: A sub mount, an emitting diode package and a manufacturing method of high heat emitting characteristic are provided to indicate high heat emitting effect by settling a plurality of emitting diodes by selectively oxidizing the metal. CONSTITUTION: A plurality of light emitting diodes(20) is settled on a sub mount. The sub mount includes a metallic body(12) and an oxide wall(14). The light emitting diodes are settled on the metallic body. An adjacent metallic body is supported on the oxide wall. The oxide wall is interposed between the metallic body in which it is adjacent it is electrically broken down. The metallic body is composed of the material including aluminium.