| 摘要 |
PROBLEM TO BE SOLVED: To prevent a wafer from colliding with a side face inside the counterbore part of a tray or projecting from the counterbore part at the time of transferring the wafer onto the tray of a carrying means. SOLUTION: This device is provided with a wafer chuck for holding the wafer 18, a wafer chuck supporting member to which the wafer chuck is attached, and a wafer pressing means attached to the wafer chuck supporting member movably in a vertical direction for pressing the upper surface of the wafer 18 from above by gravity. The wafer pressing means presses the upper surface of the wafer 18 from above, and the wafer 18 is mounted inside the counterbore part 28 formed on the tray 21. |
