发明名称 |
Image pickup device and method of manufacturing the same |
摘要 |
An image pickup device includes a sensor substrate having image sensors arranged in its image pickup region in the form of a matrix. An interlayer insulating film layer is formed below a bottom of the sensor substrate. The interlayer insulating film layer includes wiring layers to construct an electric circuit. The wiring layer is electrically connected with the image sensors. A support substrate is attached on a bottom of the interlayer insulating film layer. The support substrate has contact electrodes formed in via holes. A lens layer is formed over the top surface of the sensor substrate to be opposite to the interlayer insulating film layer. A light-transmitting member is formed over the lens layer.
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申请公布号 |
US7605404(B2) |
申请公布日期 |
2009.10.20 |
申请号 |
US20070700067 |
申请日期 |
2007.01.31 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
JUNG KYU DONG;KIM WOON BAE;CHOI MIN SEOG;LEE SEUNG WAN |
分类号 |
H01L29/22;H01L29/227;H01L33/00 |
主分类号 |
H01L29/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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