| 摘要 |
A wafer level package and a manufacturing method thereof are provided to realize a thin package by manufacturing the package without a substrate. In a wafer level package and a manufacturing method thereof, a mold(150) protects a chip(130). A conductive adhesive is formed in a lower part of the chip, and an external connection member(170) is electrically connected to the lower part of the conductive adhesive. A re-distribution layer(160) is formed between the conductive adhesive, and the redistribution layer is made of a single layer or multi-layer. An under fill is formed at both side of the chip, and the external connection member is a solder ball. |
