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发明名称
Housing of a light emitting diode package
摘要
申请公布号
USD602447(S1)
申请公布日期
2009.10.20
申请号
US20080306131F
申请日期
2008.04.03
申请人
EVERLIGHT ELECTRONICS CO., LTD.
发明人
SHENG CHUNG-HAN;CHEN YI-WEN
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主分类号
代理机构
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