| 摘要 |
A hermetically sealed structure in which a base substrate 31 and a lid 33 are hermetically sealed, the base substrate serving as a part of a containing body for uniformly forming or bonding an electronic part, the lid being a lid body to be hermetically bonded to the base substrate, is structured as follows: the lid is made from a material, through which light passes; as a metal layer 25 of at least a sealing portion of the lid a platable layer 22 for performing plating and a bonding layer 24 made from gold, the bonding layer being formed closer to the front side than the platable layer are formed; and the lid is structured so as to be bonded to the base substrate 31 by an Au-Ge alloy.
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