| 摘要 |
PURPOSE: A semiconductor installed board for CSP(Chip Scale Package) is provided to lower the response speed of the packaged semiconductor chip by preventing the diffusion phenomena of the wiring layer in the package process. CONSTITUTION: A semiconductor installed board(100) for CSP includes a wiring layer(200), a barrier(220), and a diffusion connection layer(240). The wiring layer is formed in the bottom surface of the semiconductor installed board for CSP. The barrier is plating-laminated in the upper side of the wiring layer with Ag or the Ag alloy. The barrier is plating-laminated by the electroless plating. The diffusion connection layer is plating-laminated on the upper side of the barrier with Au. |
