发明名称 |
Semiconductor encapsulant of epoxy resin, phenolic resin, phosphine-quinone adduct and OH compound |
摘要 |
There is provided an epoxy resin composition for encapsulating a semiconductor essentially comprising (A) a phenolaralkyl type epoxy resin having a phenylene structure, (B) a phenolaralkyl resin having a biphenylene structure, (C) a curing accelerator containing an adduct of a phosphine compound and a quinone compound, (D) a compound in which hydroxyl groups are attached to each of two or more adjacent carbon atoms of an aromatic ring, (E) a silane coupling agent and (F) an inorganic filler, wherein the inorganic filler (F) is contained in 84 wt % to 92 wt % both inclusive in the total amount of the epoxy resin composition.
|
申请公布号 |
US7605213(B2) |
申请公布日期 |
2009.10.20 |
申请号 |
US20060491244 |
申请日期 |
2006.07.21 |
申请人 |
SUMITOMO BAKELITE CO., LTD. |
发明人 |
MUROTANI KAZUYOSHI |
分类号 |
C08K3/36;C08L63/04;H01L23/29 |
主分类号 |
C08K3/36 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|