发明名称 |
Methods of fabricating substrates including one or more conductive vias |
摘要 |
Substrate precursor structures include a substrate blank having at least one aperture extending substantially through the substrate blank. At least a portion of at least one conductive layer covers a surface of the at least one aperture of the substrate blank. A mask pattern covers a portion of the at least one conductive layer and exposes another portion of the at least one conductive layer to define at least one conductive element, at least a portion of which extends over the surface of the at least one aperture.
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申请公布号 |
US7603772(B2) |
申请公布日期 |
2009.10.20 |
申请号 |
US20070717946 |
申请日期 |
2007.03.13 |
申请人 |
MICRON TECHNOLOGY, INC. |
发明人 |
FARNWORTH WARREN M.;MCDONALD STEVEN M.;SINHA NISHANT;HIATT WILLIAM M. |
分类号 |
H01K3/10;H01B13/00;H01L21/48;H01L23/14;H01L23/15;H01L23/498;H05K3/06;H05K3/10;H05K3/24;H05K3/42 |
主分类号 |
H01K3/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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