发明名称 NOZZLE FOR REFLOW SOLDERING DEVICE
摘要 PURPOSE: A nozzle for a reflow soldering device is provided to increase brazing precision by reducing temperature deflection of hot air and making the hot air even on the whole surface of the nozzle. CONSTITUTION: A nozzle for a reflow soldering device comprises a blower(110), a heater(130), a nozzle support body(140) and a nozzle(150). The blower ventilates upward and inhales the external air by the rotation of a blower fan. The heater heats the flowing air blown to the upper part after being inhaled by the blower. The nozzle support body discharges the hot air heated by the heater to right and left side and inhales the flow air discharged upward. A nozzle is connected to top of the nozzle support body and has nozzle pin fold zigzag inside.
申请公布号 KR20090109266(A) 申请公布日期 2009.10.20
申请号 KR20080034626 申请日期 2008.04.15
申请人 TSM CO., LTD. 发明人 LEE, JONG HO
分类号 B23K3/00;B23K1/012;H05K3/34 主分类号 B23K3/00
代理机构 代理人
主权项
地址