| 摘要 |
PURPOSE: An interconnect structure including a hybrid frame panel is provided to easily remove the heat during the operation of element for the high power device by exposing the backplane of the electric component. CONSTITUTION: An electronic component(10) includes a base insulation layer(12), at least one electric component(18), at least one I/O contact unit(24), and a frame panel(26). The base insulation layer has the first plane(14) and the second plane(16). The electric component is fixed at the base insulation layer. The electric component has the first plane(20) and the second plane(22). The I/O contact unit is positioned in the first plane of the electric component. The frame panel is the versatility structure which has the first area(28) and the second area(30). The first area includes the first material, and one side is fixed at the base insulation layer. The frame panel limits an opening. The electric component is arranged inside the opening. |
