发明名称 Photocuring Composition for Adhesive Layer and Dicing Die Bonding Film Comprising the Same
摘要 <p>A photocurable composition for a pressure-sensitive adhesive layer includes a pressure-sensitive adhesive binder, a reactive acrylate having a silicone backbone, a thermal curing agent, and a photoinitiator. The pressure-sensitive adhesive binder includes a copolymer of acrylic monomers, and a low molecular weight acrylate bonded to the copolymer, the low molecular weight acrylate having at least one pendent carbon-carbon double bond.</p>
申请公布号 KR100922684(B1) 申请公布日期 2009.10.19
申请号 KR20070088323 申请日期 2007.08.31
申请人 发明人
分类号 C09J133/08;C09J7/02;C09J183/04 主分类号 C09J133/08
代理机构 代理人
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