| 摘要 |
<P>PROBLEM TO BE SOLVED: To form a simple packaging structure which can connect an electronic component under a low pressure force and can ensure a high connection reliability, and to provide an electronic component packaging body. <P>SOLUTION: In the packaging structure, an electrode terminal 1a of a semiconductor element 1 having a multilayer wiring layer 1b composed of a micro wiring layer and a brittle insulating film of a low dielectric constant is connected to an electrode terminal 6a (here, a projecting electrode 5 formed thereon) of a circuit board 6 through a conductive bonding agent 2, to charge a sealing resin 4 between the semiconductor element 1 and the circuit board 6. A stress relaxation layer 3 is formed surrounding a connection part by the conductive bonding agent 2. <P>COPYRIGHT: (C)2010,JPO&INPIT |
