IMPROVED ADHESIVENESS TO COPPER AND COPPER ELECTROMIGRATION RESISTANCE

摘要

PROBLEM TO BE SOLVED: To provide improved adhesiveness between a patterned conductive metal layer and a patterned barrier dielectric layer.

SOLUTION: The present invention relates to improved adhesion between the patterned conductive metal layer, ordinarily copper layer, and a patterned barrier dielectric layer. The structure having the improved adhesiveness contains an adhesive layer between the patterned barrier dielectric layer and the patterned conductive metal layer. The adhesive layer improves adhesive force between the metal layer and the barrier layer without increasing bulk electric resistivity of the copper. A method of forming the structure having the improved adhesiveness includes a process wherein the patterned conductive metal layer is thermally exposed to an organic metal precursor, and at least the adhesive layer is deposited on the surface of the patterned conductive metal layer.

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