发明名称 SEMICONDUCTOR LASER DEVICE, AND MANUFACTURING METHOD OF THE SAME
摘要 PROBLEM TO BE SOLVED: To allow an N-side electrode and a P-side electrode to be easily peeled off from each other even when the N-side electrode and the P-side electrode are pressed against each other while contacting each other and heat is applied thereto, in forming a protective film. SOLUTION: This semiconductor laser device includes: a body part 11 of a semiconductor laser element inductively emitting laser light; the N-side electrode 45 formed on an N-side semiconductor 14 side of the body part 11; and the P-side electrode 41 formed on a P-side semiconductor 12 side of the body part; the foremost surface of one-side electrode out of the surfacemost of the P-side electrode 41 and that of the N-side electrode 45 is formed of gold, a gold alloy, aluminum or an aluminum alloy, and the surfacemost of the other-side electrode is formed of platinum or a platinum alloy. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2009238820(A) 申请公布日期 2009.10.15
申请号 JP20080080009 申请日期 2008.03.26
申请人 SONY CORP 发明人 SUGAWARA NOBUHIRO;ANZAI TETSUYA;SUZUKI TORU
分类号 H01S5/02 主分类号 H01S5/02
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