发明名称 NOVEL TREATMENT FOR MASK SURFACE CHEMICAL REDUCTION
摘要 A method includes forming an absorption material layer on a mask; applying a plasma treatment to the mask to reduce chemical contaminants after the forming of the absorption material layer; performing a chemical cleaning process of the mask; and performing a gas injection to the mask.
申请公布号 US2009258159(A1) 申请公布日期 2009.10.15
申请号 US20080100822 申请日期 2008.04.10
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. 发明人 SU YIH-CHEN;HSU TING-HAO;CHIN SHENG-CHI;LEE HENG-JEN;HSIEH HUNG CHANG;KU YAO-CHING
分类号 B08B6/00;B05D3/06 主分类号 B08B6/00
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