| 摘要 |
<P>PROBLEM TO BE SOLVED: To emit more light forward, and to achieve more uniform light emission and more favorable contrast. <P>SOLUTION: An optoelectronic device includes a plurality of semiconductor chips. The semiconductor chip is disposed in a recessed part of a base body or a casing absorbing, at least partially, radiation emitted from the semiconductor chip. A sidewall of the recessed part is achieved black. The semiconductor chip is, at least partially, embedded in a chip cover in the recessed part. The chip cover is permeable to radiation from the semiconductor chip, and includes radiation scattering particles. Ratio of the radiation scattering particles in the chip cover is 0.75-1.25%. The chip cover is constructed for the emission from the semiconductor chip to spread, scatter, and deflect toward a radiation output combining surface of the chip cover before the emission from the semiconductor chip collides with a side surface of an adjoining LED chip. <P>COPYRIGHT: (C)2010,JPO&INPIT |
