发明名称 |
HIGH ASPECT RATIO OPENINGS |
摘要 |
A capacitor forming method includes forming an electrically conductive support material over a substrate, with the support material containing at least 25 at% carbon. The method includes forming an opening through at least the support material where the opening has an aspect ratio of at least 20: 1 within a thickness of the support material. After forming the opening, the method includes processing the support material to effect a reduction in conductivity, and forming a capacitor structure in the opening. |
申请公布号 |
WO2009126204(A2) |
申请公布日期 |
2009.10.15 |
申请号 |
WO2009US01693 |
申请日期 |
2009.03.18 |
申请人 |
MICRON TESCHNOLOGY, INC.;KIEHLBAUCH, MARK, W. |
发明人 |
KIEHLBAUCH, MARK, W. |
分类号 |
H01L27/108;H01L21/3065;H01L21/8242;H01L27/04 |
主分类号 |
H01L27/108 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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