METHOD AND APPARATUS FOR FORMING ARBITRARY STRUCTURES FOR INTEGRATED CIRCUIT DEVICES

摘要

A method of implementing arbitrary structures to provide electrical interconnection and mechanical fixturing for integrated circuits is provided. According to exemplary embodiments of the invention said arbitrary structures are manufactured using three dimensional manufacturing processes employing only additive steps for all materials within the arbitrary structure. Accordingly the arbitrary structure is provided in a single step incorporating mechanical, electrical, and thermal elements as required by the design incorporating simultaneously dielectric and metallic materials. The arbitrary structures may be manufactured directly in association with the integrated circuits or separately for subsequent assembly to the integrated circuits. Arbitrary structures ranging from a fraction of to all of the structural and electrical elements required for packaging the integrated circuit(s) being provided by the arbitrary structures according to the design boundary established.