| 摘要 |
PROBLEM TO BE SOLVED: To achieve a uniform temperature distribution of each object to be soldered in an appropriate soldering condition when a plurality of objects are to be soldered simultaneously, thereby reducing energy consumption for heating. SOLUTION: A plurality of objects 16 are soldered simultaneously by induction heating of a support stage 14 using a high-frequency heating coil 31 while the support stage 14 supporting the objects 16 is held in a floating state. The support stage 14 is held in the floating state by making use of repulsive forces of a first magnet 12 and a second magnet 15. The support stage 14 is heated while its horizontal movement is regulated by a regulation pin 13. COPYRIGHT: (C)2010,JPO&INPIT |
