发明名称 RESIN TEMPERATURE DETECTING DEVICE AND INJECTION MOLDING MACHINE
摘要 <P>PROBLEM TO BE SOLVED: To provide a resin temperature detecting device which can easily exchange a temperature sensor. Ž<P>SOLUTION: The resin temperature detecting device 8 is installed in an injection molding machine having a barrel cylinder for heating and a nozzle 5 attached to the tip of the barrel cylinder. An engagement recess 53 is formed in the rear end surface 59 of the nozzle 5, and a temperature measurement ring 81 having a channel 81a, and pieces 51 and 52 pushing the temperature measurement ring 81 toward the tip of the nozzle 5 are engaged with the engagement recess 53. A temperature measurement pipe 82 having the temperature sensor 83 is installed to cross a channel 56 at right angles in the temperature measurement ring 81. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2009233892(A) 申请公布日期 2009.10.15
申请号 JP20080079889 申请日期 2008.03.26
申请人 SEKISUI CHEM CO LTD 发明人 MATSUMURA TOYOMASA
分类号 B29C45/20;B29C45/74 主分类号 B29C45/20
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