发明名称 HEAT TREATMENT DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a heat treatment device capable of suppressing contamination of a heat treatment chamber caused by a sublimate occurring due to formed gas generated accompanying heat treatment of a heat treating object being cooled, and leakage of the sublimate. SOLUTION: The heat treatment device 1 includes the heat treatment chamber 12, a separation tank 25, an exhaust gas system 26, an air supply system 27, and a blowing mechanism part 30. The exhaust gas system 26 and the air supply system 27 are separate systems and are connected independently to the separation tank 25. The heat treatment device 1 introduces air into the separation tank 25 via the exhaust gas system 26 and the air supply system 27 and generates a swirl flow by operating a blower 45 of the blowing mechanism part 30, mixes high temperature air of the exhaust gas system 26 with low temperature air of the air supply system 27 to cool the high temperature air, and sublimates the product gas contained in the high temperature air so that the sublimate can be collected. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2009236471(A) 申请公布日期 2009.10.15
申请号 JP20080086816 申请日期 2008.03.28
申请人 ESPEC CORP 发明人 ASHIDA KENJI;KUWATA KENJI
分类号 F27D17/00 主分类号 F27D17/00
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