| 发明名称 |
SEMICONDUCTOR CHIP WITH INTEGRATED VIA |
| 摘要 |
An integrated circuit with a substrate with a lower and an upper surface is described. A via extends between the upper and the lower surface of the substrate. The via contains a conductive filling material that comprises carbon.
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| 申请公布号 |
US2009256258(A1) |
申请公布日期 |
2009.10.15 |
| 申请号 |
US20080101501 |
申请日期 |
2008.04.11 |
| 申请人 |
KREUPL FRANZ;HEDLER HARRY |
发明人 |
KREUPL FRANZ;HEDLER HARRY |
| 分类号 |
H01L23/48;H01L21/44 |
主分类号 |
H01L23/48 |
| 代理机构 |
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代理人 |
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