发明名称 Manufacturing an insulating sheet, a copper clad laminate, and a printed circuit board
摘要 A method of manufacturing an insulating sheet, a method of manufacturing a copper clad laminate, and a method of manufacturing a printed circuit board, as well as a printed circuit board manufactured using these methods are disclosed. The method of manufacturing an insulating sheet can include: forming a thermoplastic reinforcement material, which includes fibers secured by a thermoplastic polymer binder, and in which pores are formed; forming a thermoplastic resin layer such that the thermoplastic reinforcement material is impregnated with a thermoplastic resin; and hot pressing the thermoplastic reinforcement material and the thermoplastic resin layer. This method can be utilized to manufacture an insulating sheet, which has a low rate of moisture absorption and superb electrical properties, including a low dielectric constant (Dk) and low dielectric loss (Df), and in which the fibers can readily be impregnated with the resin.
申请公布号 US2009255714(A1) 申请公布日期 2009.10.15
申请号 US20080232894 申请日期 2008.09.25
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 SOHN KEUNG-JIN;SHIN JOON-SIK;RYU JOUNG-GUL;PARK JUNG-HWAN;PARK HO-SIK;LEE SANG-YOUP
分类号 B05D3/00;B05D5/12;H05K1/00 主分类号 B05D3/00
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