发明名称 |
Manufacturing an insulating sheet, a copper clad laminate, and a printed circuit board |
摘要 |
A method of manufacturing an insulating sheet, a method of manufacturing a copper clad laminate, and a method of manufacturing a printed circuit board, as well as a printed circuit board manufactured using these methods are disclosed. The method of manufacturing an insulating sheet can include: forming a thermoplastic reinforcement material, which includes fibers secured by a thermoplastic polymer binder, and in which pores are formed; forming a thermoplastic resin layer such that the thermoplastic reinforcement material is impregnated with a thermoplastic resin; and hot pressing the thermoplastic reinforcement material and the thermoplastic resin layer. This method can be utilized to manufacture an insulating sheet, which has a low rate of moisture absorption and superb electrical properties, including a low dielectric constant (Dk) and low dielectric loss (Df), and in which the fibers can readily be impregnated with the resin.
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申请公布号 |
US2009255714(A1) |
申请公布日期 |
2009.10.15 |
申请号 |
US20080232894 |
申请日期 |
2008.09.25 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
SOHN KEUNG-JIN;SHIN JOON-SIK;RYU JOUNG-GUL;PARK JUNG-HWAN;PARK HO-SIK;LEE SANG-YOUP |
分类号 |
B05D3/00;B05D5/12;H05K1/00 |
主分类号 |
B05D3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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