| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a positive photosensitive composition improved in pattern collapse and roughness performance and to provide a pattern forming method using the above composition. <P>SOLUTION: The composition contains: (A) a compound generating an acid by irradiation with active rays or radiation; (B) a resin having a dissolving rate with an alkali developer solution, which is increased by an action of an acid; (C) and a resin having a repeating unit (c1) having a lactone group and a repeating unit (c2) having a predetermined sulfonamide structure including a fluorinated alkyl group or an alicyclic hydrocarbon group. <P>COPYRIGHT: (C)2010,JPO&INPIT |
