发明名称 |
SEMICONDUCTOR ACCELERATION SENSOR DEVICE AND METHOD FOR MANUFACTURING THE SAME |
摘要 |
Although a weight part of an acceleration sensor chip fixed on a die pad is coated with a gelatinous resin part of low elasticity, the weight part is easily displaced by an external acceleration. Thus, an acceleration can be detected with accuracy. Furthermore, long-term reliability equal to those of regular resin packages is ensured because those portions of an acceleration sensor device which are not used for acceleration sensing are sealed with a resin part.
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申请公布号 |
US2009255340(A1) |
申请公布日期 |
2009.10.15 |
申请号 |
US20090490411 |
申请日期 |
2009.06.24 |
申请人 |
OKI SEMICONDUCTOR CO., LTD. |
发明人 |
SHIZUNO YOSHINORI |
分类号 |
G01P15/08;G01P15/12;B81B7/02;G01P1/02;G01P15/18;H01L21/56;H01L23/28 |
主分类号 |
G01P15/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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